Quantum sensing microscope illuminates transistor design

Artificial intelligence faces an energy crisis stemming from a physical traffic jam inside modern computer chips. Processors ...
Electronic Design

Stacked Power MOSFETs Bring Half-Bridge Inside the Package

Using its AmpStack vertical die-stacking technology, AOS can integrate high- and low-side MOSFETs into a single package.
IEEE

Integrated Micro-Capacitors and Micro-Inductors for Next Generation Electronics

Abstract: In recent years, there has been an explosion in the power requirement of modern electronic chips [1]. Although the switching power (CV2f) per transistor has remained nearly constant with ...
C&EN

Nanocrystal-Sensitized Infrared-to-Visible Upconversion in a Microcavity under Subsolar Flux

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