MacBook Neo 8GB unified memory outperforms Windows laptops with 16GB because Apple’s InFO-PoP packaging bonds memory directly ...

At Computex 2026, Cadence announced that the ChipStack AI Super Agent achieved Level-5 autonomy and will now support NVIDIA ...

At the Future of Memory and Storage 2026 conference in Santa Clara, California, the company laid out a roadmap built around three main technologies: a new ...

Cadence has unveiled AuraStack AI Super Agent, an agentic AI platform for PCB and advanced packaging design that combines planning, automation and multiphysics analysis in a single AI-native workflow.

We recently wrapped up a project that combined two things retailers always want: customer engagement and theft prevention.

Optical circuit switches are not new and have been used in network technology research labs and in the telecom industry in production for the past two and a half decades. But the time has come for ...

Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation, etc.

Cadence Design Systems introduced AuraStack, an AI-powered agent that accelerates circuit board and chip packaging design, promising up to 50% faster time-to-market.

How AI will change the way scientific computing is done remains an open question. One relies on ultra-precise double-precision mathematics, while the other is perfectly happy working with 4 bits. On ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board ...

Running on Allegro AI Studio, the AuraStack AI Super Agent delivers up to 2X faster time to market, 15X higher productivity and multiphysics-driven quality across the industry's only silicon-to-system ...