Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI) chips utilizing its adv ...

Powertech Technology said Tuesday its fan-out panel-level packaging supply for AMD is on track to enter mass production next ...

CS PowerTech has opened the first phase of its PV cell manufacturing plant at the River Ridge Commerce Center in Jeffersonville, Indiana.

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) ...

Intel has been making a lot of noise about its upcoming 14A process, and for good reason. It is expected to be one of the biggest tests of whether the company can turn its future chip roadmap into the ...

AMD has committed more than $10 billion to Taiwan’s semiconductor ecosystem, targeting advanced packaging and manufacturing capacity as demand for artificial intelligence infrastructure intensifies ...

PALAISEAU, France, May 21, 2026 (GLOBE NEWSWIRE) -- Pasqal Holding SAS (“Pasqal”) today announced new research showing a more advanced approach to quantum computing that can deliver significantly ...

TAIPEI (Taiwan News) — Taiwanese panel manufacturer Innolux may sell its Fab 5 in Tainan’s Southern Taiwan Science Park, although the identity of a potential buyer remains uncertain, according to ...

Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry... Some subscribers ...

Chip packaging service provider Powertech Technology Inc (力成科技) yesterday said it plans to acquire a facility from AUO Corp (友達) for NT$6.9 billion (US$221.51 million) in a bid to expand advanced ...