BOE Technology glass-core substrate packaging strategy, formalized July 20, 2026, bets on Corning glass and Western ...

LG Chem, Asahi Kasei, and Sumitomo Chemical—have collectively announced plans for capacity expansion, technical cooperation, and new product development, aiming to seize a competitive first-mover ...

The semiconductor metrology and inspection equipment market, essential for advanced chip manufacturing, faces growing opportunities and challenges amid rising complexity and defect sensitivity in ...

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down. Glass improves the warpage and dimensional stability problems of organic ...

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed $50 billion by 2025, with fan-out panel-level ...

In line with its intention to become a leading force in digital labels and packaging production, Canon used its participation in the FEFCO (European Federation of Corrugated Board Manufacturers) ...

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from ...

Flow surging is defined as the oscillatory change in the rate of the extruder while maintaining constant set point conditions. Moreover, process parameters such as motor current, barrel temperatures ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

Food packaging solutions need to be redesigned to be more sustainable, but determining which solution is ‘more optimal’ is a very difficult task when considering the entire food product value chain.

4.5.1. HD Microsystem 's polyimide solution for hybrid bonding - 1 4.5.2. HD Microsystem 's polyimide solution for hybrid bonding - 2 4.5.3. Showa Denko Copper/Polyimide hybrid bonding - 1 4.5.4.