This review examines how microscopy and computational analysis can identify defects in self-assembled nanosphere structures ...
A medtech expert explains why a recall is a quality event and a national shortage is a design decision made years earlier.
Inspectahire showcases the Videray PX1 and PXT handheld X-ray systems at Farnborough, offering MRO operators faster inspections without darkrooms or disassembly.
Understanding which AM processes are achieving flight qualification, and why, requires engineers to think simultaneously about process physics, material microstructure, ...
Tomocube’s HT-T1D is a desktop holotomography system for high-resolution 3D defect analysis of glass substrates in ...
Aerospace and Mechanical Insider on MSN
Joby advances eVTOL certification with fog and propulsion-loss test
What stands out most about the most recent flight test by Joby Aviation is not the spectacle, but rather the certification ...
Key market opportunities in the global X-ray non-destructive testing equipment sector include the growing demand for advanced quality inspection in industries like aerospace and automotive, and ...
Aerospace and Mechanical Insider on MSN
AI and machine learning transform materials testing
Materials testing remains a cornerstone of engineering and manufacturing, ensuring that components and structures—from aircraft fuselages to bridge supports—perform reliably under demanding conditions ...
HYDERABAD: Ai can strengthen non-destructive testing (NDT) systems, but it cannot replace human expertise, BrahMos Aerospace Managing Director and CEO Jaiteerth ...
Stevie Awards highlights Carestream NDT HPX-ARC Digital Solutions Achievement in Product Innovation Rochester, N.Y., May 04, 2026 (GLOBE NEWSWIRE)-- Carestream NDT, a worldwide provider of digital ...
Waygate generates approximately $630 million in annual revenue with around 1,500 employees across 25 locations. The deal gives Hexagon’s Manufacturing Intelligence division computed tomography, ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
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