Semiconductor packaging is essential to the performance, reliability, and thermal management of modern electronic devices. As ...

Keysight targets cross-domain physics effects that leave electronic designs vulnerable to late-stage failure. Electronic ...

For design teams adopting 3D IC architectures, the pursuit of performance and reliability brings an increasingly complex set of challenges ...

Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and ...

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging ...

The latest edition of the multiphysics simulation magazine, COMSOL News 2026, features stories from users across a variety of ...

The Tampere startup wants to rebuild physics simulation as the data engine for AI-driven hardware design. Tampere-based Quanscient has closed a €10 million Series A to scale its cloud-based ...

Standardizing calculations of the helium byproducts generated in advanced fission and fusion energy system materials can increase reactor safety and longevity, according to a study led by University ...

Already registered? Click here to login now! As electronic devices grow more compact and power-dense, managing heat has become one of the defining engineering challenges across industries — from ...

Register now for this upcoming webinar, hosted by multiphysics simulation software provider COMSOL, exploring how to train physics AI models. Physics AI models are only as good as the data used to ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced that it has completed its previously announced acquisition of Hexagon AB’s Design and Engineering (“D&E”) business, ...