IEEE

Wide-Angle Scanning Parallel-Plate Lens in Multilayer PCB Technology

Abstract: This article presents the design of a dual-lens beamformer in multilayer printed circuit board (PCB) technology. The proposed lens is implemented in a dielectric parallel-plate waveguide ...
IEEE

Optimized Multi-Layer PCB Litz Windings for Uniform Current Distribution and Reduced Loss

Abstract: PCB Litz wire is a promising method to solve the high eddy loss issue in PCB windings. However, it suffers from high DC conduction loss due to the existing 2-layer integration style and poor ...
abc27

APIC Corporation Secures OTA From AFRL Information Directorate to Develop Prototype Trusted HIP-E Photonic PCB for Secure Multi-Level Processing

CULVER CITY, Calif., Oct. 1, 2025 /PRNewswire/ -- APIC Corporation today announced it has been awarded an Other Transaction Agreement (OTA) by the Air Force Research Laboratory (AFRL), Information ...
Magazine

A Novel Wrap Plating Method for Multilayer PCB Fabrication

Avoiding via failures caused by barrel plating separation. PCB manufacturers face challenges in the precise registration of multiple layers, which is required to ensure reliable interconnects, and in ...
Digi Times

Allied Circuit, Meiko to co-build high-layer PCB plant in Vietnam for AI servers

Compal Electronics' PCB subsidiary, Allied Circuit Co., Ltd. (ACCL), has announced a joint venture with Japan's Meiko to establish a high-layer count (HLC) printed circuit board plant in Vietnam. The ...