Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

If you’ve spent any time at all laying out your own circuit boards we’re sure you’ve run into the issue of not having the right component or package available in the standard libraries. If it’s a ...

Cadence has upgraded its Allegro and OrCAD pcb packages. The latest releases are said to bring significant new benefits, including the ability to miniaturise end product footprint and a reduction in ...