Abstract: Achieving smaller feature sizes at a lower cost remains a critical challenge in the semiconductor industry, driven by the increasing demand for higher integration and enhanced performance.

ABSTRACT: The study assessed the wind potential of three sites in Chad: Koro Toro, Salal and Nedeley. Analysis of the Weibull distribution curves reveals marked seasonal variability in wind speed, ...

OSLO, Oct 15 (Reuters) - Norway plans to eliminate its main subsidy for electric vehicles over the next two years, the government said on Wednesday, adding thousands of dollars to the cost of new cars ...

Genesis opens a major California design studio to lead its global creative direction, reinforcing its luxury identity ahead of new hybrid and high-performance models. Over 40 designers will develop ...

ABSTRACT: Visual Sensor Networks (VSNs) focus on capturing data, extracting relevant information, and enabling communication. However, the presence of obstacles affects network efficiency, linking ...

Abstract: As integrated circuit (IC) feature sizes continue to shrink, using sub-resolution assist features (SRAF) becomes increasingly crucial for improving wafer pattern resolution and fidelity.

Scientists at EPFL have reimagined 3D printing by turning simple hydrogels into tough metals and ceramics. Their process allows multiple infusions of metal salts that form dense, high-strength ...