IEEE

Laser Rework Reliability: Impact of Heat Source on Lead-Free Solder Joints in Adjacent BGA Components

Abstract: This study evaluates the reliability of adjacent reworked ball grid array (BGA) solder joints using different heat sources namely hot air and laser rework methods under thermal cycling (TCT) ...
SciELO

Characterization and Failure Analysis of Solder Joints in Ball Grid Array (BGA) Components Using Cross-Section, Dye and Pry, and Microstructural Etching Techniques

This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...
IEEE

Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework

Abstract: Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array (BGA) rework components with lead-free solder Sn3.0Ag0.5Cu (SAC305) solder joints were investigated in ...
Hackaday

Working With BGAs: Soldering, Reballing, And Rework

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...
Circuit

Tackling Head-in-Pillow Defects with Vapor Phase Reflow

An EMS finds VPS dramatically reduced HiP in BGA/LGA connectors. Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid ...
Hackaday

Working With BGAs: Design And Layout

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...