Modern electronic devices are becoming more compact while delivering greater speed and performance. From 5G communication ...
We are an Electronics Systems Design and Manufacturing services ("ESDM") company specializing in high-reliability, missioncritical electronic assemblies and systems for defence, aerospace, ...
Hirose has launched a new ball grid array (BGA) mezzanine connector designed for high-speed data applications, including a version compatible with the COM-HPC standard. The IT18 Series supports ...
"What's the current L/T for the 60mmSQ OD pkg with SAC305 on BGA with ENEPIG plating on top? Need response asap." （※記事末尾に解説あり） 朝、目を開けて最初に飛び込んでくるのは、 こんなメールが50通以上。
在PCBA生产过程中，大尺寸BGA（Ball Grid Array）器件的焊接一直是高难度工艺之一。其中，“四角翘起”（Corner Lift / Warpage）问题尤为常见，一旦发生，不仅影响焊点可靠性，还可能导致开路、虚焊 ...
Why memory prices have gotten so absurd that people are experimenting with assembling their own DDR5 modules. What's involved, from sourcing parts to soldering and flashing firmware, and whether it's ...
In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is ...
This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...
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