Modern electronic devices are becoming more compact while delivering greater speed and performance. From 5G communication ...

South Korean component maker LG Innotek announced on May 27 that it has made its first-ever appearance at the semiconductor packaging industry's largest conference, where it is pitching two substrate ...

This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...

A summary of how to order layers to achieve target impedance values. Printed circuit boards are becoming highly dense, hosting all kinds of high-speed interfaces. The bandwidth of the clock ...

Abstract: Escape routing is a critical problem in printed circuit board (PCB) routing, and its quality dramatically affects the cost of the PCB design. Unlike the traditional escape routing that works ...

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Why are test points a crucial element in developing a successful circuit? Types of test points available, and the different techniques that employ them. Electronic design has always been an endeavor ...