Abstract: This paper presents the thermal modeling of Ball Grid Array (BGA) package families using the Thermal Resistance and Impedance Calculator (TRIC) simulation tool. The intrinsic complexity and ...
Table 01: Global Underfill Market Volume (Tons) 2014H-2027F, by Material Table 02: Global Underfill Market Value (US$ Mn) 2014H-2027F, by Material Table 03: Global Underfill Market Volume (Tons) 2014H ...
Abstract: Presence of a thermal enabling load applied to Ball Grid Array (BGA) components creates a distinctive set of evaluations to be completed for reliability of solder joints (SJ) that connect ...
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