(A) Superconductivity can sometimes be induced by applying high pressure to a material which is not superconducting at ambient pressure. When pressure is released, slowly the material usually loses ...

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Why thermal management must expand beyond the PA to the package, PCB, and related circuitry. Today’s thermal challenges related to wireless-enabled devices and systems. A simulation workflow to ...

The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.1c05565. Smart citations by scite.ai include citation statements ...

Abstract: This paper reports wafer-level backside process technology, established with the intent to ensure stable operation of InP ICs in the submillimeter wavelength band, which generally suffer ...

This study reports the realization of an optical cochlear implant (oCI) with optimized thermomechanical properties for optogenetic experiments. The oCI probe comprises 144 miniaturized light-emitting ...

As powerful semiconductor laser sources open up new possibilities for the realization of compact and versatile spectroscopy and detection systems, monolithic control of the laser output ...

Vanadium sesquioxide, or V 2 O 3, is a classic, well-studied example of a metal–insulator transition (MIT) material 1,2. When cooled to 155 K, bulk V 2 O 3 undergoes a first-order phase transition ...

Abstract: In this paper, a heat spreader attachment with indium solder for high-power flip chip-in-package application was investigated. The Cu heat spreader was metallized with Ni/Au and the flip ...