Powertech Technology Inc (力成科技), which provides packaging services for memory and logic chips, yesterday said that it is on track to start shipping artificial intelligence (AI) chips utilizing its adv ...
Powertech Technology said Tuesday its fan-out panel-level packaging supply for AMD is on track to enter mass production next ...
Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) ...
Taiwan-based IC packaging and testing services provider Powertech Technology Inc. plans to set up a joint venture in Singapore with American fabless semiconductor firm Broadcom Inc. for advanced panel ...
台湾晶片封装测试公司力成科技（Powertech Technology Inc）计划投资4亿美元（约5亿1600万新元），与美国半导体大厂博通公司（Broadcom）在新加坡设立先进封装合资工厂。 力成科技星期四（7月16日 ...
Pour l’instant concentré sur le développement de ses puces Zen 6, AMD commencerait aussi à travailler sur ses futurs processeurs Zen 7. Attendus, au mieux, en 2028, ces CPU de nouvelle génération ...
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AMD, si parla già di Zen 7 “Grimlock”: nodo 1,4 nm di TSMC e nuove soluzioni 3D V-Cache?
AMD sta naturalmente già pianificando la prossima generazione di processori Zen 7, nome in codice "Grimlock", con un approccio che punta direttamente alle tecnologie produttive più avanzate previste ...
Warpage is shifting from a global bow specification to a process-dependent surface-shape problem that affects bonding, alignment, lithography, reliability, and downstream assembly. Panel-level ...
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