Introduction: Approximate numerical comparison is often influenced by various non-numerical sensory cues, yet whether they act via uniform inhibition (inhibitory control theory) or cue-weighted ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: In electromagnetic transient (EMT) simulations of electrical and electronic circuits, the compact scheme (CS) is one of the numerical integration methods that can suppress numerical ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback