Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, ...
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A roadmap for next-generation 2D semiconductor 'gate stack' technology
Seoul National University's College of Engineering announced that a research team led by Professor Chul-Ho Lee from the ...
Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced ...
Seoul National University’s College of Engineering announced that a research team led by Professor Chul-Ho Lee from the ...
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Applied Materials Unveils Next-Gen Chipmaking Systems, Aims To Boost AI Logic And Memory Performance
Applied Materials stock gained 37% year-to-date, outperforming the Nasdaq 100 index’s 19% returns, driven by demand for its wafer fabrication equipment, fueled by the AI and high-performance computing ...
Leakage through parasitic body diodes in MOSFETs: Unintended current paths can form through transistor body diodes, ...
Applied Materials sees momentum in Logic and DRAM as AI-driven demand, GAA transitions and HBM growth fuel its semiconductor leadership.
Whether your chip is running a vintage computer game or the latest DeepSeek model, it’ll reward you for speaking its native ...
At Semicon West, Applied Materials unveiled three semiconductor manufacturing systems that it said targeted specific ...
The recent Intel Technology Tour was much more than a product launch. The event showed the company's progress in leading-edge ...
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Eco-friendly method enables direct patterning of 2D semiconductors for advanced circuits
Researchers have introduced a novel technique that allows for the direct patterning of two-dimensional (2D) semiconductor ...
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