A leaked 2023 Huawei patent confirms the Mate XT 2's U-shaped tri-fold design and a new external screen. Here's what changed ...

Intel has committed 5 billion euro to expand its Leixlip campus in Ireland — the only site in Europe running EUV lithography ...

The iPhone 18 Pro's A20 Pro chip is rumoured to bring a 2nm design and new packaging technology for faster AI, better performance and battery life.

AMD used its Advancing AI 2026 event in San Francisco this week to do something it has never quite managed before: stand in ...

Leaked Amazon listings reveal the Google Pixel 11 in three new colors — Fuchsia, Moss, and Midnight. Here's what we know ...

Photonics is forcing EDA to verify not just chips, but the physics of light inside full electro-optical systems.

The pv magazine Awards recognizes excellence across the solar and energy storage supply chains, showcasing outstanding products and projects to a global audience. We are accepting entries across seven ...

Earlier this spring, AMD, Broadcom, Meta Platforms, Microsoft, Nvidia, and OpenAI formed the Optical Compute Interconnect Multi-Source Agreement (OCI MSA) to bring coherence to AI infrastructure and ...

BOE Technology glass-core substrate packaging strategy, formalized July 20, 2026, bets on Corning glass and Western ...

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is showing up in household bills and grid instability. Instead of relying only on ...

As US sanctions block access to advanced lithography, a Shanghai-based firm is betting on chip redesign and 3D memory stacking to break through bottlenecks Dongfang Suanxin, a Chinese semiconductor ...