Is This the End of the Silicon Era? Scientists Unveil World’s First 2D Computer

Researchers at Penn State have developed the first silicon-free computer using atom-thin materials. This breakthrough could reshape the future of electronics, paving the way for ultra-efficient, ...
IEEE

Reference-Free 2D-to-3D Multiple Slice Transport Average Registration (MSTAR) for Late Gadolinium Enhancement Cardiac MRI

Abstract: We present MSTAR, a reference-free statistical method for reformatting 2D image slices into a coherent 3D volumetric dataset using sliding window technique and transport averaging based ...
C&EN

Temperature-Dependent Transient Photocurrent Investigations for 2D, 3D, and Hybrid 2D/3D Tin Perovskite Films

Department of Applied Chemistry and Institute of Molecular Science, National Yang Ming Chiao Tung University, 1001 Ta-Hseuh Rd, Hsinchu 300093, Taiwan Department of Applied Chemistry and Institute of ...
IEEE

End-to-End 2D-3D Registration Between Image and LiDAR Point Cloud for Vehicle Localization

Abstract: Robot localization using a built map is essential for a variety of tasks including accurate navigation and mobile manipulation. A popular approach to robot localization is based on ...
C&EN

The Impact of Diammonium Cation Dipole Moment on Charge Transport in 2D/3D Perovskite

MOE Key Laboratory of Low-grade Energy Utilization Technologies and Systems, CQU-NUS Renewable Energy Materials & Devices Joint Laboratory, School of Energy and Power Engineering, Chongqing University ...
Wired

Should You Buy a Chromebook or a Windows Laptop?

All products featured on WIRED are independently selected by our editors. However, we may receive compensation from retailers and/or from purchases of products through these links. Learn more. Having ...
TMCnet

Lorentz Solution Jointly Presents with NVIDIA on Large-Scale 3D Terahertz EM Simulation for Real IC/3DIC Silicon Case Studies in Photonic Switches at 2025 TSMC OIP

Lorentz Solution, Inc., the world's leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the ...
Business Wire

Lorentz Solution Jointly Presents with NVIDIA on Large-Scale 3D Terahertz EM Simulation for Real IC/3DIC Silicon Case Studies in Photonic Switches at 2025 TSMC OIP

SANTA CLARA, Calif.--(BUSINESS WIRE)--Lorentz Solution, Inc., the world’s leading provider on 3D electromagnetic (EM) design platform of IC, 3DIC, and advanced packaging, today announced that it is ...