As semiconductor devices continue to become smaller and more complex, accurate thin-film metrology plays an increasingly ...

Abstract: The formation and growth kinetics of the intermetallic compound (IMC) between lead-free solder and Cu substrate in the surface mount process were studied. Optical and scanning electron ...

Abstract: Preplated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and ...

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