What once was mainly associated with design exploration now spans the manufacturing lifecycle. In packaging and assembly, ...

Think about the name, TensorFlow. It gives us a pretty good idea about how it works. A tensor is a multi-dimensional data ...

Interconnect designs were often logically correct, but rarely optimal. That has changed with smart NoC automation.

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and ...

Siemens Digital Industries Software is collaborating with TSMC to deliver product certifications and new design solutions for the foundry’s latest and most advanced process technologies. These various ...

We were recently tipped off to quite a resource — on the Texas Instruments website, there’s a page where you can view and ...

System-Hardware Co-Design with Tiered Monolithic 3D-Stackable DRAM for Efficient MoE Serving” was published by researchers at UC San Diego, Georgia Tech, University of Illinois Urbana-Champaign and ...

Though threading is a old concept in computer science, and fabric computing has been a term for about thirty years, the terminology has so far been more metaphorical than strictly descriptive.

Abstract: As software developers gain ultra-modern and AI super intelligence algorithms for everything that we use with our electronic devices, electronics are also evolving to catch the step with the ...

Abstract: Large Language Models (LLMs) have demonstrated remarkable capabilities across various domain tasks. Following this trend, this paper is dedicated to a new LLM-based design methodology for ...

Hillsboro, OR – October 10, 2025 – The Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event ...