Deal is expected to help enable scale-up photonic chiplets in AI Infrastructure 2.0 and accelerate Astera Labs’ deployment of rack-scale solutionsSAN JOSE, Calif., Oct. 22, 2025 (GLOBE NEWSWIRE) -- ...
If Broadcom says that co-packaged optics is ready for prime time and can compete with other ways of linking switch ASICs to ...
General Motors is overhauling the electrical and computational guts of its future vehicles in a bid to deliver faster ...
Researchers create a photochromic fluorescent system that performs optical neural computing and visual output in one step, ...
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Zacks Industry Outlook Highlights Analog Devices, ON Semiconductor and NXP Semiconductor
Chicago, IL – October 21, 2025 – Today, Zacks Equity Research discusses Analog Devices, Inc. ADI, ON Semiconductor Corp. ON ...
It is the JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The association says JESD328 is designed to provide a memory platform to deliver modular, ...
Fan-Out Wafer Level Packaging Market is Segmented by Type (High Density Fan-Out Package, Core Fan-Out Package), by ...
In the world of cryptocurrencies, price action only often captures half of the story—the reality of what is happening can be found where the large market movers are operating. This very week, we have ...
JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, ...
The M5 is faster and ready for AI, but beyond the familiar looks of the hardware it drives, there are plenty of meaningful ...
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