Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Tessera this morning announced an alternative to ubiquitous ball-grid technology that could significantly change both chip-scale packaging and more complex assemblies such as package-in-package ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...