Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

One of the most common questions I receive as an EMC consultant have to do with PC board design. And, no wonder. As clock and data frequencies increase towards 10 GHz, proper PC board design becomes ...

A high-performance ball-grid-array (BGA) socket developed by Ironwood Electronics, intended for the 1-mm-pitch 1521 ball BGA, operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss ...