System reliability and safety are paramount across industries such as semiconductors, energy, automotive, and steel, where ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

AI can find hidden cracks inside machines and buildings in real time, helping prevent accidents and keep industries safe.

A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...

A recent review article published in Advanced Materials explored the potential of artificial intelligence (AI) and machine learning (ML) in transforming thermoelectric (TE) materials design. The ...

Researchers from the University of Naples and the University of Wollongong have developed an AI-based method that boosts ...

Materials scientists at the University of Minnesota Twin Cities have found a way to create and control tiny "flaws" inside ...

Scientists can now create and control tiny internal defects in ultra-thin materials, enabling new properties and potential breakthroughs in nanotechnology.

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).