Abstract: The development of temporary bonding solutions for advanced packaging industry allowing mechanical support during backside processing, is driven by the demand for more robust and reliable ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
The OM System OM-3 gave users quick and easy control over its deeply customizable picture profiles with its control knob on the front of the camera. Now, the company has made it easier to find and ...
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