AZOM

Surface Metrology for In-Situ Pad Monitoring in Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.
EDN

France’s CMP offers access to ST’s 65-nm process

LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...
Digi Times

Entegris' Nano Melt Blown (NMB) CMP filtration technology further reduces defect rates related to slurry contamination

In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...
Business Wire

X-FAB Expands CMOS Optical Sensors Portfolio with Industry’s First 4-Transistor Image Sensor Process for High-Speed Applications Requiring Large Pixels

ERFURT, Germany--(BUSINESS WIRE)--X-FAB Silicon Foundries, the leading More-than-Moore foundry, today introduced XS018, the first specialized 0.18µm CMOS process for fast and large image sensor pixels ...
AZOM

The Importance of Surface Charge at the Wafer-Water Interface for Wet-Chemical Processes

When we refer to surface charge analysis, we consider the charge at the interface between a material and a surrounding aqueous solution. With respect to the semiconductor field, knowing the charge at ...