Traditional planar NAND flash has had a long and illustrious run, but its time is over. Multiple manufacturers have announced they have no plans to pursue 2D NAND below the 15nm process node. Share on ...
Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the ...
3D NAND flash memory is built by vertically stacking multiple alternating layers (tiers) of silicon nitride (SiN) and oxide (TEOS) on top of each other. A major challenge in producing multilayered 3D ...
The NAND market is likely to be significantly under supplied in FY 2017. IM's NAND cost superiority will offer Micron much better gross margins at the year advances. Micron's aggressive move to ...
For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...
SK hynix on Monday said it had commenced mass production of its 321-layer, 2Tb 3D QLC NAND memory devices that promise to enable ultra-high-capacity SSDs — up to 244TB and beyond — for data center use ...
Samsung Electronics Co has launched mass production of 286-layer NAND chips, enhancing storage capacity by 50%. Ninth-gen 3D NAND memory targets AI data centers, smartphones; samples shipped to Google ...
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