Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as ...

Launching a pilot 'chip design to tapeout' flow curriculum, enabling academic institutions with industry-aligned coursework. Pilot testing underway at over 40 select worldwide universities with intent ...

Cadence’s AI design flows now support TSMC’s N2 and A16 technologies, while new silicon-proven IP is available for TSMC N3P.

Cadence Design Systems is a mission-critical enabler of next-gen industries, boasting high recurring revenues, robust client retention, and an AI-driven product portfolio. The company’s oligopolistic ...

From left to right: UT Ph.D. student Song Hang Chai, post-doctoral researcher Hyunsu Chae, professor David Pan and assistant professor Sensen Li. Radio frequency integrated circuits (RFIC) are ...

Experts at the Table: Semiconductor Engineering sat down to discuss the advantages and challenges in using AI in designing chips, with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Hong Kong (CNN) — The administration of US President Donald Trump has lifted restrictions on exports of chip design software to China, as Washington and Beijing work to dial down hostilities as part ...