Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks Ansys ...

Ansys ANSS is leveraging NVIDIA Corporation’s NVDA Omniverse application programming interfaces (APIs). This will “supercharge” the design of 3D integrated circuits (3D-ICs) through the integration of ...

Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...

Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...

In a move to address the growing complexity of semiconductor design, Ansys (NASDAQ:ANSS) has entered into a strategic alliance with Taiwan Semiconductor Manufacturing Company (NYSE:TSMC) and Microsoft ...